Material Compatibility

The CNF aims to enable all research areas possible without compromising the fabrication capabilities of the existing tool set and processes. Maintaining the process capability of the CNF tool set while serving a wide range of research goals requires a system in place to prevent the possibility of chamber/tool contamination and process degradation that may come with incompatible materials.

Tool Categories are divided into 6 groups, Category 1, 1E, 2, 3, 4 and 5, with Category 1 being the most restrictive in allowed materials and Category 5 having the least amount of restrictions. Substrates and samples are required to be assessed by the researchers and CNF staff prior to utilizing the tool.

Please contact the CNF User Program staff to evaluate new projects and process flows and to highlight possible conflicts with materials and tool usages.

1 - Restricted Silicon Based Materials Only

Tool Category 1:Restriced Silicon Based Materials Only
Allowed Not Allowed

Silicon Based Materials only

(Si, SiC, SiO2 substrates)

No Evaporated, Sputtered, or Spin on Films
All Furnace grown or deposited films No ALD films
PECVD Films No Metal or Organic Films
  No Glass Substrates
  No III/V Compound Semiconductors
  No Deep Silicon Etched Samples (versaline, Unaxis)
  No Organic/Biology Molecules prepared-with or without Salt buffers

 

1E - Silicon Based Materials and Select Dieletrics

Tool Category 1E: Silicon Based Materials and Select Dieletrics
Allowed Not Allowed
Silicon Based Materials only No Evaporated or Sputtered Films
Si, SiC, SiO2 substrates No Metal or Organic Films
All Furnace grown or deposited films No Glass Substrates
PECVD Films No III/V Compound Semiconductors
Select ALD dieletrics (SiO2, SiN, HfO2, HFN) No High Vapor pressure materials
Spin on Glass and Spin on Dopants Organic/Biology Molecules prepared-with or without Salt buffers

 

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.

2 - Silicon Based Substrates and Select Refractory Metals

Tool Category 2: Silicon Based Substrates and Select Refractory Metals
Allowed Not Allowed
Tool category 1/1E materials No Glass Substrates
Silicon Based Materials only

No CNF Class A or Class B metals and oxides/compounds of (exposed or buried)

(ie Magnesium, Zinc, Barium, Calcium)

Si, SiC, SiO2 substrates  
All Furnace grown or deposited films  
PECVD Films No Gold,  Silver or Copper (Exposed or buried)
ALD dieletric films

No High Vapor pressure materials

CNF Refractory Metals (ie Al, Ti,Ta,W,Pt,Mo,Cr,Ni) No III/V Compound Semiconductors
Nitrides and Oxides of above metals No Organic/Biology Molecules prepared-with or without Salt buffers
Cured organics and baked Photoresist  

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.

3 - Silicon, III-V Compound Semiconductor, Glass and Metal Category

Tool Category 3: Silcion, III-V Compound Semiconductor, Glass and Metal Category
Allowed Not Allowed
Tool category 1/1E and 2 materials Glass Substrates
III/V compound Semiconductors allowed No CNF Class A or Class B metals-and oxides/compounds of i.e. (Magnesium,Zinc, Barium, Calcium)
PECVD and ALD  Films No High Vapor pressure materials
Cured organics and baked Photoresist  
Organic/Bio Materials prepped w/o Salt Buffers  

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.

4 - Glass and Metal Categories

Tool Category 4: Glass and Metal Categories
Allowed Not Allowed
Tool category 1/1E, 2, and 3 materials  

Silicon Based Substrates and Films

No CNF Class A metals
III/V compound Semiconductors No Exposed CNF Group B metals- metals can be buried/covered with staff approval
Glass Substrates Cannot be used as an etch stop
PECVD and ALD  Films  
Buried Class B Metals with approval  
Organic/Bio Materials prepped w/o Salt Buffers  
Cured organics and baked Photoresist No High Vapor pressure materials

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.

5 - Class A and B Metals and Compounds

Tool Category 5: Class A and B Metals and Compounds
Allowed Not Allowed
Tool category 1/1E, 2, 3, and 4 materials  
Silicon Based Substrates and Films  
III/V compound Semiconductors  
Glass Substrates  
PECVD and ALD  Films  
Cured organics and baked Photoresist  
CNF Class A, B, and Refractory metals  
Exposed Gold, Silver, Copper  
Alkali and Alkaline Compounds  
Organic/Biology Molecules prepared-w/salt buffers  
High Vapor Pressure Materials (Mg, Ca, Zn)* * Some tool restrictions on high vapor pressure materials may apply
Soft organic materials  

 

High Vapor Pressure Metals and Compounds are materials that have a vapor pressure above 1e-6 Torr at 400 C.