Nordtech Eq Image
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Applications
Temporary bonding and debonding. Temporary Bonding of substrates on to different types of carriers (substrate to substrate, glass sapphire ceramic, different adhesives). Mechanical support for thinned wafers or wafers to be thinned for additional processing
Capabilities
- Can handle wafers that are - less that 40 um thick
- Uniform and repeatable debonding
Estimated Arrival
Beginning of March 2025
Projected Availability
March 2025