Oxford Instruments PlasmaPro ASP

Image of Oxford Instruments PlasmaPro ASP
Applications

The PlasmaPro ASP atomic layer deposition system provides high-rate, biased, plasma ALD with low damage deposition of conformal, tunable oxides and nitrides.

Capabilities
  • Configured to deposit Al2O3, AlN, SiO2, Si3N4, HfO2, HfN, TaO5, TaN, Nb2O5, NbN, TiO2, and TiN.
  • N2/H2 mixture as a knob for tuning composition of nitride films
  • 6 precursors - 5 gas inputs (max number of precursors and gas inputs)
  • Small chamber volume and optimized piping configuration--- results in much faster deposition rates than traditional ALD systems.
  • 240mm biased electrode with 300W RF generator & auto-match unit (AMU), max 400°C with removable cover plate
  • Remote plasma source with 600W RF generator & auto-match unit (AMU) Configured to handle 50mm, 75mm, 100mm, 125mm, 150 mm or 200mm wafers
Estimated Arrival
May 2025
Projected Availability
July 2025