YES-PB6-2P-CP Vacuum Cure Oven

Applications

This YES-PB6-2P-CP Laminar Flow High Temperature (up to 450°C) Vacuum Cure Oven is a critical part of packaging technology infrastructure, to be used in many projects, including quantum related projects.

Capabilities

Supports sample sizes up to 200mm (up to 50 wafers)
8 temperature profiles (up to 200 recipes)
Used for curing polyimide,
Epoxy and wafer to wafer bonding annealing, in particular for packaged integrated parts.

Estimated Arrival

Arrived

Projected Availability

Operational – installed and ready