Applications
For electroplating of Indium and Silver/Tin/Antimony/Copper Solder Alloys
Capabilities
- Open to substrates from pieces to 200mm wafers.
- (2) Electroplating cells with drag out tanks
- Cascade rinse tank
- Static
- Acid clean tank Non-contact wiper
Estimated Arrival
March 2025
Projected Availability
July 2025