DISCO DAG810 AUTOMATIC SURFACE GRINDER and DI H2O Recycling Unit

The DA810 is a compact, automatic grinder for thinning of workpieces up to 8” in diameter. It has one spindle and one chuck table and is designed to process a variety of materials including Silicon, Glasses, Sapphire, Silicon Carbide and III-V’s. The DI H20 treatment and recycling unit will also couple with existing dicing saw to allow cutting of toxic/hazardous materials e.g., III-V’s