Nordtech Eq Image
Image
Applications
Able to etch through Silicon wafers with ~1.5um of photoresist all the way to the edge of the wafer.
Capabilities
- Deep silicon etch for wafer dicing
- RF 300W generator & amu match for ETCH
- Heated Chamber Lid and Upper Chamber Liners
- Cold Mode Protection Ring
- Fluid-cooled / electrically-heated etch lower electrode
- 200 mm wafers down to small chips as well as non-traditional chip designs
- Electrostatic clamping
- Dual gas pods, one to supply the chamber and one to supply the gas ring
Estimated Arrival
April 2025
Projected Availability
June 2025