Applications
Provides Damage Free Resist Processing, Megasonic Cleaning and Spin Drying of Glass or Silicon Substrates up to 12” in Diameter or 5” and 6” square substrate/mask.
Capabilities
- Manual Load and Unload User Programmable Cleaning Cycles
- Spinner with Poly Pro cover, Poly Pro Megasonic cleaning arm, Poly Pro bowl
- Chemical Dispense unit with four 1 gal HDPE canisters for solvents/surfactants with level sensors
- PVA Brush cleaning (~400 RPM)
- DIW dispense through brush
- Back side DIW flush and N2 dry
- Five Chucks: 100mm, 150 mm, 200 mm wafer chucks and 5” and 6” mask chucks
Estimated Arrival
Arrived
Projected Availability
July 2025